HyPACT

HyPACT is setting a new industrial standard in Europe by pioneering hybrid bonding and fatigue-free packaging for high-performance electronics. Moving beyond traditional solder and adhesive interconnects, HyPACT develops quasi-monolithic 3D assemblies that offer superior mechanical strength, thermal stability, and integration density. Targeting automotive, industrial automation, and power electronics, the project enables advanced chiplet architectures combining silicon, SiC, and GaN in ultra-compact modules, pushing innovation in surface prep, pad design, and thermal management.