Semicon China 2026
AI, smart devices, and advanced packaging are reshaping the semiconductor landscape. At SEMICON China 2026, Besi presents its comprehensive range of assembly equipment, built to meet the highest demands of precision, scalability, and efficiency. Hall N3, booth N3645.
Event information
25 - 27 Mar 2026
Shanghai, China
Shanghai New International Expo Centre
Hall N3, booth N3645
The semiconductor industry is evolving rapidly, driven by AI, smart devices, and advanced packaging innovations. At SEMICON China 2026, Besi will showcase its full suite of advanced semiconductor assembly equipment, designed to optimize efficiency, precision, and scalability in modern manufacturing.
Explore our industry-leading solutions, including:
- Die Attach Equipment – High-precision bonding for epoxy, flip chip, and soft solder applications.
- Packaging Equipment – Cutting-edge molding, trim & form, and singulation solutions for leadframe and wafer-level packaging.
- Plating & Cleaning Equipment – State-of-the-art continuous plating and leadframe cleaning for maximum performance and reliability.
- Visit Hall N3, booth N3645 to connect with our experts and discover the latest breakthroughs in semiconductor assembly!
Event information
25 - 27 Mar 2026
Shanghai, China
Shanghai New International Expo Centre
Hall N3, booth N3645
