Products and services

Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. We offer customers high levels of accuracy, reliability and throughput at a lower cost of ownership with a principal focus on wafer level and substrate assembly solutions. We define advanced packaging as  the assembly of semiconductor devices using advanced interconnect processes including flip chip, System-in-Package (“SiP”), hybrid, TCB and other wafer level technologies as well as  all molding technologies related thereto. We also supply after-sales service and spares to customers which is a less cyclical and growing part of Besi’s revenue  mix.